Japan, U.S. to lay out road map for more chip cooperation


TOKYO -- Japan and the U.S. are set to outline their plans for joint development of next-generation semiconductors, as the allies look to flesh out their bilateral cooperation in the strategic sector, Nikkei has learned.
The road map will be included in a joint statement that the two governments plan to issue at a ministerial meeting in Detroit, Michigan, on Friday. The plan…

This story appeared on asia.nikkei.com.
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