Samsung Invests In Japan Facility To Take On Taiwan Semiconductor In Chip Packaging

benzinga.com/markets/tech/25/08/47153183/samsung-invests-in-japan-facility-to-take-on-taiwan-semiconductor-in-chip-packaging

Samsung Electronics (OTC:SSNLF) earmarked 25 billion yen ($170 million) to establish an advanced chip packaging R&D center in Yokohama, Japan, intensifying its competition with Taiwan Semiconductor Manufacturing Co (NYSE:TSM) in the packaging market.
The global advanced chip packaging…

This story appeared on benzinga.com, 2025-08-15 12:54:28.
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